Amada miyachi benchtop hot bar bonding heads

AMADA MIYACHI Benchtop hot bar bonding heads หัว hot bar bonding

Technical specifications.

Reflow heads.

50F/LRF force range lds (newtons) 0.08 to 2.2 (0.4 to 9.8) application guideline light force pinpoint soldering.

50F/RF force range lds (newtons) 0.275 to 2.2 (1.22 to 9.8) application guideline light force pinpoint soldering.

87A/EZ force range lds (newtons) 0.5 to 20 (2.2 to 89)small medium soldering.

87F force range lds (newtons) 0.25 to 20 (1.1 to 89)small medium soldering.

87SA/24 2 to 20 (8.9 to 88.9) Flex soldering and bonding.

SH80 1.8-18.0(8-80) Small and medium soldering and flex soldering.

SH500 6.7-112.4 (30-500) medium and large soldering, flex soldering and ACF bonding.

System solutions.

Desktop bonders 1.8-112.4 (8-500) small to large solderin, flex soldering and ACF bonding request see datasheet 991-006.

Auxiliary thermocouples.

AUXTC/E Auxiliary thermocouple, type E, 5 ft. long.

AUXTC/K Auxiliary thermocouple, type K, 5 ft. long.

AUXTC/J Auxiliary thermocoupple, type J, 5 ft. long.

Pulse heated thermodes.

17P description Peg tip Application/Size inchs(mm) thermocompresion bonding-single point soldering0.020 to 0.093 (0.5 to 2.4).

17T description T tip Application/Size inchs(mm) thermocompresion bonding-single point soldering0.008 x0.010(0.2 to 0.25).

17BM description Blade Application/Size inchs(mm) Multiple contacts 0.030 to 1.0 (0.76 to 25.4).

17F description Nichrome fold-up Application/Size inchs(mm) Multiple contacts 0.25 to 1.0 (6.45 to 25.4).

17TD descriptionThree dimension Application/Size inchs(mm) Multiple contacts 1.0 to 3.0 (25.4 to 76.2).